Hong Kong, China

Chongshan Liu

This inventor holds 2 USPTO granted patents. Top assignees: Hong Kong Applied Science and Technology Research Institute, Hong Kong Centre for Logistics Robotics Limited. Active years: 2022-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chongshan Liu. Retrieved from https://idiyas.com/inventor/chongshan-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022-2026

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2 patents (USPTO):Explore Patents

Title: Innovations of Chongshan Liu in 3D Scene Analysis

Introduction

Chongshan Liu is a notable inventor based in Hong Kong, China. He has made significant contributions to the field of computer vision, particularly in the identification of planes within 3D scenes. His innovative approach has led to the development of a patented method that enhances the understanding of 3D objects.

Latest Patents

Chongshan Liu holds a patent for a "Method and apparatus for identifying planes of objects in 3D scenes." This patent describes computer-implemented methods and computerized apparatus for identifying planes of a 3D object in a 3D scene. The method involves receiving a point cloud and performing plane segmentation. It voxelizes the point cloud into a plurality of voxels of equal dimensions and classifies them into three categories based on specific planar requirements and neighborhood constraints. The process generates at least one reference plane from the first category voxels, which is then used to represent the 3D object for further applications. He has 1 patent to his name.

Career Highlights

Chongshan Liu is associated with the Hong Kong Applied Science and Technology Research Institute Company Limited. His work at this institution has allowed him to explore advanced methodologies in 3D scene analysis and contribute to the technological advancements in this area.

Collaborations

Chongshan Liu has collaborated with notable colleagues such as Xueyan Tang and Chun Li. Their combined expertise has fostered a productive environment for innovation and research.

Conclusion

Chongshan Liu's contributions to the field of 3D scene analysis through his patented methods demonstrate his commitment to advancing technology. His work continues to influence the way we understand and interact with 3D objects in various applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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