Tokyo, Japan

Chongfa Xie

This inventor holds 1 USPTO granted patent. Top assignee: Mitsubishi Electric Corporation. Active years: 2026.


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: The Innovations of Chongfa Xie

Introduction

Chongfa Xie is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology. His work focuses on improving the manufacturing processes of semiconductor devices.

Latest Patents

Chongfa Xie holds 1 patent for his invention titled "Terminal member, assembly, semiconductor device, and methods for manufacturing same." This patent addresses the workability in the manufacturing process of a semiconductor device. The terminal member is designed to be joined to an electrode of a semiconductor element. It includes a conductor portion, a first annular projecting portion, and an annular recess. The conductor portion features a first main surface and a second main surface located on the opposite side. The first annular projecting portion is situated on the first main surface, while the annular recess is on the second main surface, overlapping with the first annular projecting portion. By pressing a joining member against the first main surface, the first annular projecting portion can be embedded in the joining member, enhancing the overall manufacturing process.

Career Highlights

Chongfa Xie is currently employed at Mitsubishi Electric Corporation, where he continues to innovate in the semiconductor field. His work has been instrumental in advancing the technology used in semiconductor devices.

Collaborations

Chongfa Xie has collaborated with notable colleagues such as Takao Mitsui and Ryuichi Ishii. Their combined expertise contributes to the innovative environment at Mitsubishi Electric Corporation.

Conclusion

Chongfa Xie's contributions to semiconductor technology exemplify the importance of innovation in manufacturing processes. His patent reflects a commitment to improving workability in semiconductor device production.

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