Shoreview, MN, United States of America

Chong-Yong J Kim

This inventor holds 2 USPTO granted patents. Top assignee: 3M Innovative Properties Company. Active years: 2003-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chong-Yong J Kim. Retrieved from https://idiyas.com/inventor/chong-yong-j-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 2

Forward Citations = 42(Granted Patents)


Company Filing History:


Years Active: 2003-2004

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2 patents (USPTO):Explore Patents

Title: Innovations of Chong-Yong J Kim

Introduction

Chong-Yong J Kim is a notable inventor based in Shoreview, MN (US). He has made significant contributions to the field of abrasive technology, particularly in the polishing of wafers. With a total of 2 patents, his work has advanced the methods used in semiconductor manufacturing.

Latest Patents

Chong-Yong J Kim's latest patents include an innovative abrasive article featuring a window system designed for polishing wafers. This process involves a textured abrasive coating affixed to a backing, which incorporates a monitoring element, such as a window. This window allows for the transmission of radiation, enabling the monitoring of radiation levels throughout the planarization process. This monitoring is crucial for determining the approach to the desired endpoint. The window can either be an area devoid of abrasive coating or one with minimal or thinned abrasive coating.

Career Highlights

Chong-Yong J Kim is associated with 3M Innovative Properties Company, where he has been instrumental in developing advanced abrasive technologies. His expertise in this area has led to significant improvements in the efficiency and effectiveness of wafer polishing processes.

Collaborations

Chong-Yong J Kim has collaborated with notable colleagues, including Michael J Muilenburg and Jerry J Fizel. These collaborations have further enhanced the innovative capabilities within his field.

Conclusion

Chong-Yong J Kim's contributions to abrasive technology and wafer polishing are noteworthy. His patents reflect a commitment to innovation and improvement in semiconductor manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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