Beijing, China

Chong Peng

This inventor holds 1 USPTO granted patent. Top assignee: Beijing Grand Hitek. Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chong Peng. Retrieved from https://idiyas.com/inventor/chong-peng-wasfpj7c

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Chong Peng: Inventor of an Improved-Capacity Vacuum Pump Assembly

Introduction

Chong Peng is an inventor based in Beijing, China, and is associated with Beijing Grand Hitek Co., Ltd. His work includes an invention designed to improve the handling of process by-products in vacuum pumps. The provided information lists 1 patent for Peng.

Latest Patents

Peng’s listed patent is titled “Vacuum Pump Assembly with Improved Process By-Product Holding Capacity.” It describes an assembly with a front bearing plate, upper and lower casings, long and short rotors, and a rear bearing plate. The rotors turn in opposite directions on parallel axes, with their multiple stages of rotor elements meshing correspondingly.

The design places storage grooves on non-critical surfaces of the meshing rotor elements. These grooves increase the assembly’s capacity to hold process by-products and help prevent pump jamming and wear caused by by-product adhesion.

Career Highlights

The available information connects Peng’s invention to Beijing Grand Hitek Co., Ltd. The patent focuses on addressing operational challenges in vacuum pump assemblies through a rotor design that accommodates process by-products.

Collaborations

Min Wei and Xiaohong Lei are identified as Peng’s coworkers. The provided information does not specify their roles in the patent or the nature of their collaboration.

Conclusion

Chong Peng’s listed patent presents a vacuum pump assembly designed to improve by-product handling and reduce jamming and wear. It highlights his contribution to practical equipment design in Beijing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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