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Years Active: 2023
Title: Innovations of Chiu Wing Chan in Hierarchical Architectures
Introduction
Chiu Wing Chan is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of materials science, particularly in the development of innovative techniques for constructing hierarchical architectures. His work focuses on enhancing the functionality and efficiency of materials used in various applications.
Latest Patents
Chiu Wing Chan holds a patent titled "Crack engineering as a new route for the construction of arbitrary hierarchical architectures." This invention addresses the challenges associated with the design and manufacturing of three-dimensional (3D) hierarchical morphologies. These structures are essential for applications involving liquid and mass transport, energy conversion, and signal transmission. The patent introduces a novel method that utilizes configurable elastic crack engineering to create complex hierarchical structures with broad material compatibility and structural integrity. This approach not only reduces costs but also enables large-scale production of flexible, inexpensive, and transparent 3D hierarchical materials.
Career Highlights
Throughout his career, Chiu Wing Chan has been associated with prestigious institutions such as Hong Kong Baptist University and The Hong Kong University of Science and Technology. His work has garnered attention for its innovative approach to material design and processing, contributing to advancements in the field.
Collaborations
Chiu Wing Chan has collaborated with esteemed colleagues, including Kangning Ren and Hongkai Wu. Their joint efforts have furthered research and development in the area of hierarchical materials, enhancing the potential applications of their findings.
Conclusion
Chiu Wing Chan's innovative contributions to the field of hierarchical architectures demonstrate his commitment to advancing materials science. His patent on crack engineering offers a promising solution for the efficient production of complex materials, paving the way for future advancements in various applications.