The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2023
Filed:
Oct. 23, 2020
Hong Kong Baptist University, Hong Kong, HK;
The Hong Kong University of Science and Technology, Hong Kong, HK;
City University of Hong Kong, Hong Kong, HK;
Kangning Ren, Hong Kong, HK;
Hongkai Wu, Hong Kong, CN;
Zuankai Wang, Hong Kong, HK;
Shuhuai Yao, Hong Kong, CN;
Beng Ong, Hong Kong, HK;
Wanbo Li, Hong Kong, HK;
Zeyu Li, Hong Kong, HK;
Han Sun, Hong Kong, HK;
Chiu Wing Chan, Hong Kong, HK;
Hong Kong Baptist University, Hong Kong, HK;
The Hong Kong University of Science and Technology, Hong Kong, HK;
City University of Hong Kong, Hong Kong, HK;
Abstract
Three-dimensional (3D) hierarchical morphologies widely exist in natural and biomimetic materials, which impart preferential functions including liquid and mass transport, energy conversion, and signal transmission for various applications. While notable progress has been made in the design and manufacturing of various hierarchical materials, the state-of-the-art approaches suffer from limited materials selection, high costs, as well as low processing throughput. Herein, by harnessing the configurable elastic crack engineering-controlled formation and configuration of cracks in elastic materials, an effect normally avoided in various industrial processes, the present invention provides a facile and powerful technique to enable the faithful transfer of arbitrary hierarchical structures with broad material compatibility and structural and functional integrity. The present invention provides a cost-effective, large-scale production method of a variety of flexible, inexpensive, and transparent 3D hierarchical and biomimetic materials.