Company Filing History:
Years Active: 2008
Title: **ChinHup Chua: Innovator in Electronic Device Housing**
Introduction
ChinHup Chua, an accomplished inventor based in Singapore, has made significant contributions to the field of electronic device manufacturing. Known for his innovative approach to sealing techniques, Chua's work has led to the creation of a relevant patent that enhances the functionality and reliability of electronic devices.
Latest Patents
Chua holds a patent for an "Overmold Component Seal in an Electronic Device Housing." This inventive solution focuses on forming seals between parts of overmold components, which are essential in protecting sensitive internal environments of electronic devices from external contaminants. The invention describes a process where a first part featuring thorough-holes—such as screw holes or material entrance holes—is surrounded by adhesive prior to the overmolding of a second part. This technique allows for effective sealing, ensuring the integrity of devices such as disc drives.
Career Highlights
ChinHup Chua works at Seagate Technology Incorporated, a leader in data storage solutions. His role involves harnessing his expertise in engineering to drive innovation and enhance product designs. Through his patent, Chua has demonstrated not only technical skill but also a keen understanding of market needs in the realm of electronic devices.
Collaborations
During his tenure at Seagate Technology, Chua has collaborated with notable colleagues such as Mo Xu and Johaan S J Koong. Together, they have contributed to research and development efforts aimed at improving the company’s product offerings and advancing technological frontiers in the electronic device sector.
Conclusion
ChinHup Chua's inventive spirit and dedication to quality are evident in his contributions to the field of electronics. Through his patent on the overmold component seal, Chua is set to influence how electronic devices are designed and manufactured, ensuring durability and efficiency. His work continues to pave the way for future innovations in the industry.