The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2008
Filed:
Jun. 28, 2005
MO Xu, Singapore, SG;
Johaan S. J. Koong, Singapore, SG;
Chinhup Chua, Singapore, SG;
Khaiyi Auyeong, Singapore, SG;
Kokwah Tan, Singapore, SG;
Mo Xu, Singapore, SG;
Johaan S. J. Koong, Singapore, SG;
ChinHup Chua, Singapore, SG;
KhaiYi AuYeong, Singapore, SG;
KokWah Tan, Singapore, SG;
Seagate Technology LLC, Scotts Valley, CA (US);
Abstract
In general, the invention is directed to techniques for forming a seal between parts of an overmold component. The overmold component includes a first part forming one or more thorough-holes and a second part overmolded to the first part. A through-hole may be, for example, a screw hole or an overmold material entrance hole. The through-holes formed by the first part are surrounded by an adhesive prior to overmolding the second part. After overmolding, the adhesive locally bonds the surface of the first part to the overmold part to make a seal around the through holes. For example, the overmold component may combine with a cover to form a housing of a disc drive or other electronic device defining an internal environment. In this example, the adhesive prevents external contaminants from entering the internal environment via the through-holes.