Ching-Wen Wen

Title: Innovations of Ching-Wen Wen in Semiconductor Fabrication

Introduction

Ching-Wen Wen is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 4 patents. His work focuses on enhancing the efficiency and effectiveness of semiconductor fabrication processes.

Latest Patents

One of Ching-Wen Wen's latest patents involves a dielectric film for semiconductor fabrication. This method includes receiving a device with a first surface that exposes a first metal or an oxide of the first metal. The process further entails depositing a dielectric film composed of silicon (Si), nitrogen (N), carbon (C), and oxygen (O) over the first surface. Notably, the dielectric film has a higher concentration of nitrogen and carbon in a first portion near the first surface compared to a second portion further away. This innovative approach allows for the formation of a conductive feature over the dielectric film, which electrically insulates the conductive feature from the first metal or its oxide.

Career Highlights

Ching-Wen Wen is currently employed at Taiwan Semiconductor Manufacturing Company Ltd. His expertise in semiconductor technology has positioned him as a key player in the industry. His innovative methods contribute to advancements in semiconductor fabrication, which are crucial for the development of modern electronic devices.

Collaborations

Ching-Wen Wen collaborates with talented individuals in his field, including Cheng-Yi Wu and Li-Hsuan Chu. Their combined efforts enhance the research and development of semiconductor technologies.

Conclusion

Ching-Wen Wen's contributions to semiconductor fabrication through his innovative patents demonstrate his commitment to advancing technology in this critical field. His work continues to influence the future of semiconductor manufacturing.