Ching-Wen Teng

Title: Ching-Wen Teng: Innovator in Wafer Polishing Technology

Introduction

Ching-Wen Teng is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor manufacturing. He holds a patent that addresses a critical aspect of wafer polishing, which is essential for the production of high-quality semiconductor devices.

Latest Patents

Ching-Wen Teng's most recent patent is titled "Cleaning process of wafer polishing pad and cleaning nozzle." This innovative process involves providing a wafer polishing pad and performing a planarization process, which leaves a residue on the pad. The invention includes a cleaning step utilizing a specialized cleaning nozzle that features a Y-shaped pipe. This design allows for efficient removal of residue, enhancing the overall cleaning process in semiconductor manufacturing.

Career Highlights

Ching-Wen Teng is currently employed at United Semiconductor (Xiamen) Co., Ltd., where he applies his expertise in semiconductor technology. His work focuses on improving processes that are vital for the efficiency and effectiveness of wafer polishing.

Collaborations

Ching-Wen Teng collaborates with talented colleagues, including Shih-Jie Lin and Kuo Liang Huang, who contribute to the innovative environment at United Semiconductor.

Conclusion

Ching-Wen Teng's contributions to wafer polishing technology exemplify the importance of innovation in the semiconductor industry. His patent not only enhances cleaning processes but also reflects his commitment to advancing technology in this critical field.