Ching-Wen Chiang

Title: Innovations of Ching-Wen Chiang

Introduction

Ching-Wen Chiang is a notable inventor based in Chiayi, Taiwan. He has made significant contributions to the field of antenna technology, holding a total of nine patents. His work focuses on advanced antenna-in-package constructions and integrated radio frequency multi-chip packages.

Latest Patents

One of his latest patents is titled "Antenna-in-package construction with frequency division duplex technology." This invention features a unique antenna-in-package construction that includes a chip layer, a second dielectric layer, and a first dielectric layer stacked in order. The first dielectric layer has a dielectric constant greater than 3.5. The construction comprises a transmitting antenna array, a receiving antenna array, and metal isolated pillars. The transmitting antenna array extends from the chip layer to the first dielectric layer through the second dielectric layer, while the receiving antenna array extends from the chip layer to the second dielectric layer. The arrangement of the transmitting and receiving antenna arrays is in an alternating interleaved sequence, with metal isolated pillars surrounding each antenna. The chip layer contains at least one transmitting chip and one receiving chip, which are electrically connected to their respective antenna arrays.

Another significant patent is the "Structure of integrated radio frequency multi-chip package and method of fabricating the same." This invention describes an antenna package structure that includes a substrate with a first and second surface. A dielectric layer is disposed on the first surface, which contains an impedance matching structure and an interconnection structure. A molding layer is placed on the dielectric layer, housing multiple chips, including a control chip that connects to the impedance matching structure. An antenna layer is located on the second surface of the substrate, which includes at least one antenna that connects to the substrate. A protection layer covers the antenna layer, ensuring its integrity.

Career Highlights

Ching-Wen Chiang has worked with prominent organizations such as the National Chung Shan Institute of Science and Technology and the Industrial Technology Research Institute. His experience in these institutions has allowed him to develop and refine his innovative ideas in antenna technology.

Collaborations

Ching-Wen has collaborated with several talented individuals, including Yen-Cheng Kuan and Chia-Jen Liang, who have contributed to his research and development efforts.

Conclusion

Ching-Wen Chiang's contributions to antenna technology through his innovative patents highlight his expertise and dedication to advancing the field. His