The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Dec. 20, 2017
Applicant:

National Chung Shan Institute of Science and Technology, Taoyuan, TW;

Inventors:

Ching-Wen Chiang, Chiayi, TW;

Yen-Cheng Kuan, Kaohsiung, TW;

Chia-Jen Liang, Kaohsiung, TW;

Chien-Te Yu, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 21/56 (2006.01); H01Q 1/22 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01Q 5/10 (2015.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/3157 (2013.01); H01L 23/49833 (2013.01); H01L 23/552 (2013.01); H01Q 1/2283 (2013.01); H01Q 5/10 (2015.01); H01L 2223/6677 (2013.01);
Abstract

A multi-band antenna package structure includes a first redistribution layer; an integrated circuit layer, formed on the first redistribution layer, comprising at least one metal via, at least one metal pillar, an integrated circuit chip, and a molding layer, wherein the molding layer is used to fill openings formed by the metal via, the metal pillar and the integrated circuit chip which are disposed on the first redistribution layer, the metal via is electrically connected to one of the first metal patterns of the first redistribution layer; a second redistribution layer, formed on the integrated circuit layer; and a first antenna unit layer, comprising a first dielectric layer and third metal patterns formed in openings of the first dielectric layer, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit.


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