Ching-Wei Liu

Title: Innovations of Ching-Wei Liu

Introduction

Ching-Wei Liu is a notable inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of technology, particularly in sensor packaging and collapsible structures. With a total of three patents to his name, Liu continues to push the boundaries of innovation.

Latest Patents

One of Liu's latest patents is a production apparatus for manufacturing a sensor package structure. This innovative design includes a sensing die, a light-filtering sheet, and an annular pressure-sensitive adhesive sheet. The active surface of the sensing die features a sensing region and a connecting region, ensuring that the periphery contour of the sensing die is greater than or equal to that of the light-filtering sheet. The pressure-sensitive adhesive sheet is designed with two opposite adhesive surfaces and defines an opening, allowing the sensing region to face the inner surface of the light-filtering sheet. This design provides a sensor package structure that is low cost, high capacity, and high yield.

Another notable patent is the thin-type collapsible foot stand. This invention consists of a base unit, a first rotatable unit, and a second rotatable unit. The base unit features a base body with a first pivot portion, a first connection portion, and a first extending portion. The first rotatable unit includes a rotatable platform that corresponds to the base unit, while the second rotatable unit comprises two rotatable support frames. This design allows for a compact and efficient foot stand that can be easily collapsed.

Career Highlights

Ching-Wei Liu is currently employed at Azurewave Technologies, Inc., where he applies his expertise in developing innovative technologies. His work has significantly impacted the industry, particularly in the areas of sensor technology and structural design.

Collaborations

Liu has collaborated with several talented individuals, including Yu-Ting Cheng and Chi-Hsing Hsu. These collaborations have fostered a creative environment that encourages the development of groundbreaking inventions.

Conclusion

Ching-Wei Liu's contributions to technology through his patents and innovative designs highlight his role as a leading inventor in his field. His work continues to inspire advancements in sensor packaging and collapsible structures.