Ching Shui Cheng

Title: Innovations by Ching Shui Cheng in Image Sensor Packaging

Introduction

Ching Shui Cheng is an innovative inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of image sensor technology. His work focuses on improving the packaging structures of image sensors, which are crucial for enhancing their performance and reducing manufacturing costs.

Latest Patents

Ching Shui Cheng holds a patent for a "Packaging structure of image sensor and method for packaging the same." This patent describes a packaging structure that includes a substrate, an image sensing chip, a plurality of wirings, and a transparent layer. The substrate consists of multiple metal sheets sealed with glue, featuring a first surface and a second surface. The metal sheets create first and second contacts exposed to the outside. The image sensing chip is mounted on the substrate, with bonding pads connected to the first contacts through the wirings. The transparent layer is positioned above the image sensing chip, allowing for a simplified packaging process using plastic materials, which ultimately lowers manufacturing costs.

Career Highlights

Ching Shui Cheng has demonstrated a strong commitment to innovation in his field. His patent reflects his ability to address complex challenges in image sensor packaging. By focusing on efficiency and cost-effectiveness, he has positioned himself as a valuable contributor to the technology sector.

Collaborations

Ching Shui Cheng has worked alongside talented colleagues, including Li Huan Chen and Hsiu Wen Tu. Their collaborative efforts have likely contributed to the advancements in their projects and innovations.

Conclusion

Ching Shui Cheng's work in image sensor packaging exemplifies the importance of innovation in technology. His patent not only simplifies the manufacturing process but also enhances the performance of image sensors. His contributions are a testament to the ongoing advancements in the field.