Ching-Ming Yang

Title: Innovations of Ching-Ming Yang in Heat Dissipation Technology

Introduction

Ching-Ming Yang is a prominent inventor based in New Taipei, Taiwan. He has made significant contributions to the field of heat dissipation technology, holding a total of 15 patents. His innovative designs focus on improving the efficiency of cooling systems, particularly in electronic applications.

Latest Patents

Among his latest patents, Yang has developed a two-phase immersion-type heat dissipation structure featuring acute-angle notched structures. This design includes a heat dissipation substrate with a fin surface and a non-fin surface. The non-fin surface is designed to contact a heat source immersed in a two-phase coolant, while the fin surface connects with a plurality of fins. Notably, more than half of these fins are functional, with specific angles defined between the surfaces to optimize performance.

Another significant patent is the two-phase immersion-cooling heat-dissipation structure that has a shortened evacuation route for vapor bubbles. This structure consists of an immersion-cooling substrate and fins that enhance the cooling process. The design includes skived fins that are integrally formed on the substrate, ensuring efficient heat transfer and vapor bubble evacuation.

Career Highlights

Ching-Ming Yang is currently employed at Amulaire Thermal Technology, Inc., where he continues to innovate in the field of thermal management solutions. His work has been instrumental in advancing technologies that address the growing demands for efficient cooling in various industries.

Collaborations

Yang collaborates with talented coworkers, including Tze-Yang Yeh and Chun-Te Wu, who contribute to the development of cutting-edge thermal technologies. Their combined expertise fosters an environment of innovation and creativity.

Conclusion

Ching-Ming Yang's contributions to heat dissipation technology exemplify the importance of innovation in enhancing the efficiency of cooling systems. His patents reflect a deep understanding of thermal dynamics and a commitment to advancing the field.