Ching Ku Lin

Title: Ching Ku Lin: Innovator in Circuit Board Technology

Introduction

Ching Ku Lin is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of circuit board technology, holding a total of 2 patents. His innovative work focuses on improving the performance and structure of circuit boards, which are essential components in modern electronic devices.

Latest Patents

Ching Ku Lin's latest patents include a circuit board with low grain boundary density and a method for improving wire structure in circuit boards. The first patent describes a circuit board that features a first circuit layer, a dielectric layer, and a seed layer that directly contacts the first circuit layer. This design aims to reduce the grain boundary density in the second circuit layer, enhancing the overall performance of the circuit board. The second patent outlines a multi-layer circuit board that incorporates various conductive circuits and an adhesion promoter layer, which improves the wire structure and connectivity within the board.

Career Highlights

Ching Ku Lin is currently employed at Unimicron Technology Corporation, a leading company in the field of circuit board manufacturing. His work at Unimicron has allowed him to apply his innovative ideas and contribute to the advancement of circuit board technology. His patents reflect his commitment to enhancing the efficiency and reliability of electronic components.

Collaborations

Ching Ku Lin has collaborated with notable coworkers, including Jia Hao Liang and Chun Kuo. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in circuit board design.

Conclusion

Ching Ku Lin's contributions to circuit board technology through his patents and work at Unimicron Technology Corporation highlight his role as an influential inventor in the electronics industry. His innovative designs continue to shape the future of circuit board applications.