Ching-Hui Hung

Title: Innovations by Ching-Hui Hung: A Look into His Patent Contributions

Introduction

Ching-Hui Hung, an accomplished inventor based in Taichung Hsien, Taiwan, has contributed significantly to the field of semiconductor technology. With a keen focus on enhancing the reliability and efficiency of semiconductor packages, he holds a noteworthy patent that showcases his innovative spirit and technical expertise.

Latest Patents

Ching-Hui Hung's sole patent involves an innovative interconnection structure for semiconductor packages. This design aims to improve the bonding pads on a substrate, featuring a nickel layer on each bonding pad, a metal layer above it, and a solder material on top. The choice of metal—be it gold, silver, lead, or copper—is critical, as it determines the thickness of the layer, which ranges from 0.5 to 5 micrometers. This targeted design prevents the formation of nickel-tin compounds during the reflow process, effectively avoiding issues like cracking or delamination of solder bumps, thus enhancing the integrity of semiconductor packages.

Career Highlights

Ching-Hui Hung currently serves at Siliconware Precision Industries Co., Ltd. This esteemed company specializes in advanced semiconductor packaging technology and has been a leader in the industry. His work at Siliconware has allowed him to translate theoretical designs into practical applications, influencing advancements in semiconductor manufacturing.

Collaborations

Throughout his career, Ching-Hui has collaborated with talented colleagues, including Chang-Fu Lin and Ho-Yi Tsai. These partnerships have further enriched his inventive processes, facilitating the exchange of ideas and pushing the boundaries of what is possible in the realm of semiconductor technology.

Conclusion

Ching-Hui Hung's contributions to the field of semiconductor packaging are evident through his innovative patent. By focusing on critical aspects of design and material selection, he addresses significant challenges in the industry, affirming his reputation as a pivotal figure in semiconductor innovations. His work continues to pave the way for future advancements in the field, inspiring both current and aspiring inventors.