Ching-Hsin Ho

Title: Innovations of Ching-Hsin Ho in Multi-Layer Printed Circuit Boards

Introduction

Ching-Hsin Ho is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of electronics, particularly in the development of multi-layer printed circuit boards. With a total of 2 patents to his name, his work showcases innovative solutions that enhance the performance and reliability of electronic components.

Latest Patents

Ching-Hsin Ho's latest patents focus on multi-layer printed circuit boards with dimensional stability. The first patent describes a multi-layer printed circuit board that comprises a core with a core insulation layer and traces formed on both sides of the core insulation layer. This design includes a plurality of insulation layers sequentially formed on either side of the core, along with trace layers positioned between the insulation layers and on the outermost insulation layers. The core insulation layer is made from a resin material that differs from that of the insulation layers, providing superior dimensional stability.

Career Highlights

Ching-Hsin Ho is currently employed at Elite Material Co., Ltd., where he continues to innovate in the field of printed circuit boards. His work has been instrumental in advancing the technology used in electronic devices, making them more efficient and reliable.

Collaborations

Ching-Hsin Ho collaborates with talented individuals such as Ya-Wen Kuo and Li-Chih Yu, who contribute to the innovative projects at Elite Material Co., Ltd. Their teamwork fosters a creative environment that leads to groundbreaking advancements in their field.

Conclusion

Ching-Hsin Ho's contributions to the development of multi-layer printed circuit boards demonstrate his commitment to innovation in electronics. His patents reflect a deep understanding of materials and design, paving the way for future advancements in the industry.