Xinzhuang, Taiwan

Ching Hsien Tsai

This inventor holds 1 USPTO granted patent. Top assignee: Aisa Vital Components Co., Ltd.. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ching Hsien Tsai. Retrieved from https://idiyas.com/inventor/ching-hsien-tsai-557jx1xp

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Ching Hsien Tsai

Introduction

Ching Hsien Tsai is a prominent inventor based in Sinjhuang, Taiwan. She has made significant strides in the field of thermal management technology. Her innovative approach has led to the development of a unique thermal module that enhances heat dissipation efficiency.

Latest Patents

Ching Hsien Tsai holds 1 patent for her invention of a thermal module. This thermal module comprises at least one heat dissipating element, at least one cooling chip, and a heat radiating unit. The design allows the cooling chip to have a cold end in contact with one side of the heat dissipating element and a hot end in contact with the heat radiating unit. This direct contact enables the heat dissipating element to be effectively cooled, resulting in a simplified structure that occupies less space while providing enhanced heat-dissipating efficiency.

Career Highlights

Ching Hsien Tsai is currently associated with Aisa Vital Components Co., Ltd. Her work at the company focuses on advancing thermal management solutions. Her contributions have been instrumental in improving the performance of electronic devices through better heat dissipation technologies.

Conclusion

Ching Hsien Tsai's innovative work in thermal management exemplifies the impact of effective engineering solutions in technology. Her patent for the thermal module showcases her commitment to enhancing efficiency in heat dissipation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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