Taichung, Taiwan

Ching-Hsiang Yang

This inventor holds 1 USPTO granted patent. Top assignee: Dell Products Inc.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ching-Hsiang Yang. Retrieved from https://idiyas.com/inventor/ching-hsiang-yang-rsjj61ru

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2023

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations of Ching-Hsiang Yang

Introduction

Ching-Hsiang Yang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of information handling systems, particularly in enhancing the efficiency of cooling mechanisms.

Latest Patents

Ching-Hsiang Yang holds a patent for a "Tool-less apparatus and methods for sealing the flow of cooling fan air to a heat exchanger." This innovative patent provides a tool-less solution for sealing the flow of cooling air from a cooling fan blower to a heat exchanger within a chassis enclosure. The design allows for easy alignment and securement of the cooling fan's air outlet with the heat exchanger's air inlet, ensuring optimal performance without any gaps.

Career Highlights

Ching-Hsiang Yang is currently employed at Dell Products Inc., where he continues to develop and refine technologies that improve information handling systems. His work focuses on creating efficient and user-friendly solutions that enhance system performance.

Collaborations

Ching-Hsiang has collaborated with talented coworkers, including Yi-Chang Yeh and Yu-Ming Kuo, who contribute to the innovative environment at Dell Products Inc.

Conclusion

Ching-Hsiang Yang's contributions to the field of cooling systems in information handling are noteworthy. His innovative patent reflects his commitment to improving technology and efficiency in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…