Ching-Hohn Len

Title: Ching-Hohn Len: Innovator in Electrical Device Packaging

Introduction

Ching-Hohn Len is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of electrical device packaging. His innovative approach has led to the development of a unique manufacturing method that enhances the durability of electrical devices.

Latest Patents

Ching-Hohn Len holds 1 patent for his invention titled "Electrical device package structure and manufacturing method thereof." This patent discloses a manufacturing method that involves providing an electrical device body with at least two electrodes. The outer surface of the electrical device body is partially covered by the electrodes, which are in turn covered by a plastic material. The method includes forming a first protective layer made of phosphate salt on the exposed outer surface of the electrical device body, followed by a second protective layer made of glass on the first protective layer. This innovative design prevents damage to the electrical device body and electrodes during the manufacturing process, while also avoiding the formation of a high impedance layer on the electrodes.

Career Highlights

Ching-Hohn Len is currently employed at SFI Electronics Technology Inc., where he continues to work on advancements in electrical device technology. His expertise and innovative mindset have positioned him as a valuable asset to the company.

Collaborations

Ching-Hohn Len collaborates with talented individuals such as Hong Zong Xu and Zhi Xian Xu. Their combined efforts contribute to the ongoing development of cutting-edge technologies in the field.

Conclusion

Ching-Hohn Len's contributions to electrical device packaging demonstrate his commitment to innovation and excellence. His patented methods not only enhance the durability of electrical devices but also pave the way for future advancements in the industry.