Company Filing History:
Years Active: 2014
Title: Innovations of Ching-Chiuan Wei
Introduction
Ching-Chiuan Wei is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on enhancing the efficiency and reliability of semiconductor devices.
Latest Patents
Ching-Chiuan Wei's latest patents include a method for fabricating a quad flat non-leaded semiconductor package. This innovative design features a die pad, I/O connections at the periphery, and a chip mounted on the die pad. The encapsulant used in this package encapsulates the die pad, I/O connections, chip, and bonding wires while exposing the bottom surfaces. A surface layer is formed on these surfaces, along with a dielectric layer that has openings to expose the surface layer. This design prevents solder material from permeating into the die pad during the reflow process, thereby increasing product yield.
Career Highlights
Ching-Chiuan Wei is currently employed at Siliconware Precision Industries Co., Ltd. His work has been instrumental in advancing semiconductor packaging technologies, contributing to the overall efficiency of electronic devices.
Collaborations
Ching-Chiuan Wei has collaborated with notable coworkers, including Fu-Di Tang and Yung-Chih Lin, who have also contributed to the field of semiconductor technology.
Conclusion
Ching-Chiuan Wei's innovations in semiconductor packaging demonstrate his commitment to improving technology in this critical field. His patents reflect a deep understanding of the challenges in semiconductor manufacturing and offer solutions that enhance product reliability and yield.