This inventor holds 1 USPTO granted patent. Top assignee: Industrial Technology Research Institute. Active years: 2019.
Company Filing History:
Years Active: 2019
Title: Innovations by Ching-Chen Hsieh
Introduction
Ching-Chen Hsieh is a notable inventor based in Hemei, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of magnetic and thermally conductive materials. His work is recognized for its potential applications in various industries, enhancing the efficiency and performance of thermal management systems.
Latest Patents
Ching-Chen Hsieh holds a patent for a magnetic and thermally conductive material, which includes a thermally conductive compound powder and an iron-containing oxide at the surface of the thermally conductive compound powder. The iron-containing oxide is an oxide of iron combined with other metals such as nickel, zinc, copper, cobalt, magnesium, manganese, yttrium, lithium, aluminum, or a combination thereof. This innovation also encompasses a thermally conductive and dielectric layer that integrates this magnetic and thermally conductive material with a resin.
Career Highlights
Hsieh is affiliated with the Industrial Technology Research Institute, where he has been instrumental in advancing research and development in material technologies. His innovative approach has led to the creation of materials that can significantly improve thermal conductivity and magnetic properties, making them valuable in various applications.
Collaborations
Ching-Chen Hsieh has collaborated with notable colleagues, including Chun-Pin Wu and Mean-Jue Tung, who contribute to the research and development efforts in their respective fields. Their teamwork fosters an environment of innovation and creativity, leading to groundbreaking advancements in material science.
Conclusion
Ching-Chen Hsieh's contributions to the field of materials science through his innovative patents and collaborations highlight his role as a key inventor in the industry. His work continues to pave the way for advancements in thermal management technologies.
