Chin Wen Lin

Title: Innovations of Chin Wen Lin

Introduction

Chin Wen Lin is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electrical engineering, particularly in the area of chip stacking technology. His innovative approach has led to the development of a unique method that enhances the efficiency of electrical component interconnections.

Latest Patents

Chin Wen Lin holds a patent for a "Method and apparatus for stacking electrical components using via to provide interconnection." This patent describes an efficient chip stacking structure that includes a leadframe with two surfaces, each capable of attaching stacks of chips. The design allows for a chip stack to be formed by placing a chip's active surface on the back surface of another chip. Electrical connections between the chips and leads on the leadframe are facilitated by bonding pads on the chip active surfaces and vias that extend from the bonding pads through the chips to the back surfaces. He has 1 patent to his name.

Career Highlights

Chin Wen Lin is currently employed at Macronix International Co., Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of chip stacking and interconnection methods.

Collaborations

Chin Wen Lin collaborates with his coworker, Chen Jung Tsai, to further enhance their research and development efforts in the field of electrical components.

Conclusion

Chin Wen Lin's contributions to the field of electrical engineering, particularly through his innovative patent, demonstrate his commitment to advancing technology. His work at Macronix International Co., Ltd. continues to influence the industry positively.