Company Filing History:
Years Active: 2004-2008
Title: Innovations by Chin-Teng Hsu
Introduction
Chin-Teng Hsu is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His work focuses on improving the reliability and efficiency of semiconductor devices.
Latest Patents
One of his latest patents is a method for fabricating a semiconductor package with a short-prevented lead frame. This innovation involves forming each lead of the lead frame with a thickness-reduced portion at a peripheral position. The staggered arrangement of these thickness-reduced portions significantly increases the pitches between neighboring leads, preventing lead bridging and short-circuiting during the singulation process. This advancement enhances the quality, yield, and reliability of semiconductor products. Another notable patent is a wire-bonding method and a semiconductor package utilizing this method. The design includes a carrier and a chip mounted on it, with first and second wires arranged in a staggered manner. This configuration prevents contact and short circuits between wires during the encapsulation process, further improving the reliability of the semiconductor package.
Career Highlights
Chin-Teng Hsu is currently associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His innovative approaches have contributed to the advancement of semiconductor technology, making him a valuable asset in his field.
Collaborations
He has collaborated with notable coworkers, including Jui-Hsiang Hung and Holman Chen, to further enhance the development of semiconductor technologies.
Conclusion
Chin-Teng Hsu's contributions to semiconductor packaging through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to impact the industry positively, ensuring improved reliability and efficiency in semiconductor devices.