Chin Te Chen

Title: Innovations by Chin Te Chen in Semiconductor Packaging

Introduction

Chin Te Chen is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to technology.

Latest Patents

One of his latest patents is the "Ball grid array semiconductor package and method of fabricating the same." This technology focuses on improving the ball grid array semiconductor packaging process. It features openings in the solder mask that are strategically placed to eliminate air during the die bonding process, preventing void formation. This advancement ensures that high temperatures during the reflowing process do not compromise the quality of the semiconductor package.

Another notable patent is the "Window-type multi-chip semiconductor package." This invention involves a substrate with an opening where multiple chips are mounted. The design allows for efficient electrical interconnection through bonding wires, enhancing the overall performance of the semiconductor package. The encapsulation process further protects the chips and bonding wires, ensuring reliability and efficiency.

Career Highlights

Chin Te Chen is associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His work has significantly impacted the development of advanced packaging technologies, making him a key figure in this field.

Collaborations

Chin Te Chen has collaborated with notable coworkers such as Wei-Cheng Tseng and Kuo-Chu Chiang. Their combined expertise has contributed to the successful development of innovative semiconductor solutions.

Conclusion

Chin Te Chen's contributions to semiconductor packaging through his patents reflect his dedication to innovation and excellence in technology. His work continues to influence the industry, paving the way for future advancements in semiconductor packaging.