Kaohsiung, Taiwan

Chin-Pei Huang

This inventor holds 1 USPTO granted patent. Top assignee: Windell Corporation. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chin-Pei Huang. Retrieved from https://idiyas.com/inventor/chin-pei-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Chin-Pei Huang: Innovator in Organic Electroluminescent Device Packaging

Introduction

Chin-Pei Huang is a notable inventor based in Kaoshiung, Taiwan. He has made significant contributions to the field of organic electroluminescent devices. His innovative approach to packaging these devices has the potential to enhance their longevity and performance.

Latest Patents

Chin-Pei Huang holds a patent for a "Method for packaging organic electroluminescent device." This method involves several steps, including forming multiple organic EL devices on a transparent substrate. It also includes laying binding layers on a plastic laminated board to create a package, forming cavity domains for package cans, and binding the lateral face of the package can. This process effectively segregates the organic EL devices from the external atmosphere, thereby extending their lifespan.

Career Highlights

Chin-Pei Huang is currently associated with Windell Corporation, where he applies his expertise in the development of advanced packaging solutions. His work focuses on improving the efficiency and durability of organic electroluminescent devices.

Collaborations

Chin-Pei Huang collaborates with talented individuals such as Hsueh-Wen Chen and Kuang-Jung Chen. Their combined efforts contribute to the innovative projects at Windell Corporation.

Conclusion

Chin-Pei Huang's contributions to the field of organic electroluminescent devices through his patented packaging method demonstrate his commitment to innovation. His work not only enhances device performance but also paves the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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