Taipei, Taiwan

Chin-Jung Tsao


 

Average Co-Inventor Count = 4.4

ph-index = 1


Company Filing History:


Years Active: 2018-2021

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2 patents (USPTO):Explore Patents

Title: Innovations of Chin-Jung Tsao: A Peek into His Patented Creations

Introduction

Chin-Jung Tsao, an accomplished inventor based in Taipei, Taiwan, has made significant contributions to the fields of cooling systems and shared computing technologies. With two patents to his name, Tsao exemplifies the spirit of innovation in modern technology.

Latest Patents

Tsao's most recent patents include advancements in two key areas. The first patent focuses on innovative cooling systems. In this patent, a cooling system is described comprising multiple adjacent fan modules designed to generate efficient cooling flows. A central fan cage supports these modules, allowing them to rotate and optimize airflow. This system includes a first support bracket and a bush within the fan cage to enhance functionality.

The second patent revolves around shared USB ports. This system features a first computing device and a second computing device, each equipped with its own baseboard management controller (BMC). It utilizes a multiplexor to connect a shared USB port to either the first or second USB port, enabling efficient data transfer and connectivity between devices.

Career Highlights

Chin-Jung Tsao currently works at Hewlett Packard Enterprise Development LP, where he continues to innovate and contribute to cutting-edge technologies. His experience in the tech industry and commitment to research have led to the successful development of his patented technologies.

Collaborations

Throughout his career, Tsao has collaborated with renowned colleagues, including Chih-Sheng Liao and Kang-Jong Peng. These collaborations have fostered a creative environment that ultimately leads to the successful development of impactful inventions.

Conclusion

Chin-Jung Tsao's work exemplifies the importance of innovation in the tech industry. His patents reflect a commitment to enhancing technology through efficient cooling solutions and sharable connectivity options. As he continues his work at Hewlett Packard Enterprise Development LP, the impact of his inventions is sure to resonate within the technology landscape for years to come.

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