Chin-Hung Lo

Title: Chin-Hung Lo: Innovator in Micro Light-Emitting Diode Technology

Introduction

Chin-Hung Lo is an inventor based in Hsinchu City, Taiwan. He is known for his work in the field of micro light-emitting diode (LED) technology. Although he currently holds no granted patents, his contributions to the development of innovative packaging structures for micro LEDs are noteworthy.

Latest Patent Applications

Chin-Hung Lo's latest patent application is titled "MICRO LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND FORMING METHOD THEREOF." This application describes a micro light-emitting diode package structure that includes micro LED dies, a light-transmitting layer, a first insulating layer, redistribution layers, and conductive elements. The micro LED dies are arranged side by side, each featuring an electrode surface, a light-emitting surface, and side surfaces. The light-transmitting layer covers the light-emitting surface and the side surfaces, while the first insulating layer is positioned beneath the micro LED dies, making direct contact with the electrode surface. The redistribution layers are located under the first insulating layer and connect electrically to the electrode surface. The conductive elements are situated beneath the redistribution layers and are electrically connected to them.

Conclusion

Chin-Hung Lo's innovative approach to micro LED technology showcases his potential as an inventor in the field. His latest patent application reflects a significant advancement in micro LED packaging, which could have a lasting impact on the industry.