Midland, MI, United States of America

Chin Huan Cheng

This inventor holds 3 USPTO granted patents. Top assignee: The Dow Chemical Company. Active years: 1977-1988.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chin Huan Cheng. Retrieved from https://idiyas.com/inventor/chin-huan-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 3

Forward Citations = 98(Granted Patents)


Company Filing History:


Years Active: 1977-1988

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3 patents (USPTO):Explore Patents

Title: The Innovations of Chin Huan Cheng

Introduction

Chin Huan Cheng is a notable inventor based in Midland, MI (US). He has made significant contributions to the field of insulation technology, holding a total of 3 patents. His work focuses on improving the efficiency and effectiveness of thermal insulation.

Latest Patents

Cheng's latest patents include a thermal insulating panel, which features an improved vacuum panel of double wall construction. Another significant invention is a method of insulating cryogenic vessels, which enhances insulation value by incorporating evacuated tubing within the insulation.

Career Highlights

Chin Huan Cheng is currently employed at The Dow Chemical Company, where he applies his expertise in insulation technology. His innovative approaches have contributed to advancements in the industry, particularly in the development of materials that enhance energy efficiency.

Collaborations

Cheng has collaborated with notable coworkers, including Burton D Brubaker and Wilhelm E Walles. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Chin Huan Cheng's work exemplifies the spirit of innovation in insulation technology. His contributions continue to impact the industry positively, showcasing the importance of research and development in creating efficient solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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