Company Filing History:
Years Active: 2022-2025
Title: Innovations of Chin-Hsien Wang
Introduction
Chin-Hsien Wang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor design and layout optimization. With a focus on improving design rule violations, his work has led to the development of innovative methods that enhance the efficiency of semiconductor layouts.
Latest Patents
Chin-Hsien Wang holds 2 patents that showcase his expertise in layout optimization. His latest patents include a method and system for fixing violations of layout. This method involves identifying a layer of a first layout based on a first violation generated on that layer. It generates a metal density value associated with the layer and classifies the first violation into a class corresponding to routing congestions. The process includes assigning a first operation from pre-stored operations to perform on the first layout, resulting in a second layout. Another patent focuses on receiving design rule violations of a first layout, classifying a first violation according to chip features, and generating a second layout based on selected operations.
Career Highlights
Chin-Hsien Wang has worked with prominent companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company Limited and TSMC Nanjing Company, Limited. His experience in these organizations has allowed him to refine his skills and contribute to significant advancements in semiconductor technology.
Collaborations
Throughout his career, Chin-Hsien Wang has collaborated with talented individuals such as Yi-Lin Chuang and Song Liu. These collaborations have fostered innovation and have been instrumental in the development of his patented technologies.
Conclusion
Chin-Hsien Wang's contributions to semiconductor design and layout optimization are noteworthy. His innovative patents and collaborations reflect his commitment to advancing technology in this critical field. His work continues to influence the industry and pave the way for future innovations.