This inventor holds 1 USPTO granted patent. Top assignee: Tekcon Electronics Corp.. Active years: 2001.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2001
Title: Chin-Hsien Hsu: Innovator in Electric Connector Technology
Introduction
Chin-Hsien Hsu, an inventive mind based in Taipei, Taiwan, has made significant contributions to the field of electrical engineering. His expertise has led to the creation of innovative solutions in electric connector technologies that are essential for modern electronic devices.
Latest Patents
Chin-Hsien Hsu holds a patent for a "Metal shield and connector body arrangement of an electric connector." This design includes a connector body shrouded by a metal shield, constructed from a bent metal sheet, optimizing the connections within electrical devices, including computers. The arrangement features a metal spring plate that connects grounding strips to the mainframe's metal shell, enhancing the reliability and performance of electrical connections.
Career Highlights
Hsu is currently employed at Tekcon Electronics Corp., where he continues to refine and innovate electrical connector technology. His commitment to developing practical solutions has positioned him as a valuable asset in his field.
Collaborations
In his endeavors, Chin-Hsien Hsu collaborates with notable coworkers such as Chih-Kai Chang, contributing to projects that leverage their combined knowledge and skills. This teamwork fosters an environment of innovation, pushing the boundaries of what is possible in the realm of electrical connectors.
Conclusion
Chin-Hsien Hsu's contributions to electric connector technology reflect his dedication to innovation and problem-solving. His patent stands as a testament to his skill and vision, and his ongoing work at Tekcon Electronics Corp. continues to impact the industry positively. As technology evolves, Hsu remains at the forefront, designing solutions that will shape the future of electrical connectivity.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile