Chin Fa Wang

Title: Innovations of Chin Fa Wang in Semiconductor Technology

Introduction

Chin Fa Wang is a notable inventor based in Tai-Ping, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the design and fabrication of semiconductor packages. His innovative approach has led to advancements that enhance the performance and efficiency of semiconductor devices.

Latest Patents

Chin Fa Wang holds a patent for a semiconductor package with enhanced chip groundability and a method of fabricating the same. This patent describes a semiconductor package that features a ground pad on a chip, which is electrically connected to a ground plane on a substrate. The connection is achieved through an electrically-conductive wall formed over the side surface of the chip and an electrically-conductive adhesive used for attaching the chip to the substrate. This design allows for a simplified wire-bonding process, as it only requires the implementation of power pads and signal I/O pads on the chip. The elimination of ground wires for electrical connection purposes reduces the number of bonding wires needed and simplifies wire arrangement. Additionally, the grounding path from the chip to the substrate is shorter than conventional methods, which reduces ground-bouncing effects and improves the electrical performance of the semiconductor package.

Career Highlights

Chin Fa Wang is associated with Siliconware Precision Industries, Ltd., where he has been instrumental in developing innovative semiconductor solutions. His work has contributed to the company's reputation as a leader in the semiconductor packaging industry.

Collaborations

Chin Fa Wang has collaborated with notable colleagues, including Wen-Ta Tsai and Yuan-Ping Joe. Their combined expertise has fostered advancements in semiconductor technology and has led to successful innovations in the field.

Conclusion

Chin Fa Wang's contributions to semiconductor technology through his innovative patent and collaborations highlight his role as a significant inventor in the industry. His work continues to influence the development of efficient semiconductor packages, showcasing the importance of innovation in technology.