Company Filing History:
Years Active: 2019-2020
Title: Innovations by Chin-Ching Huang
Introduction
Chin-Ching Huang is a notable inventor based in Zhudong, Taiwan. He has made significant contributions to the field of chip packaging technology. With a total of 2 patents to his name, Huang's work is recognized for its innovative approaches to enhancing chip structures.
Latest Patents
Huang's latest patents include a chip package and manufacturing method that features a comprehensive design. The first patent describes a chip package that consists of a chip structure, a molding material, a conductive layer, a redistribution layer, and a passivation layer. This design ensures that the chip structure is effectively protected while maintaining electrical connectivity. The second patent also focuses on a chip package that includes a sensing chip and a computing chip, surrounded by a protective layer. This innovative design allows for efficient interaction between the sensing and computing elements, enhancing overall performance.
Career Highlights
Chin-Ching Huang is currently employed at Xintec Corporation, where he continues to develop cutting-edge technologies in chip packaging. His work has been instrumental in advancing the capabilities of electronic devices, making them more efficient and reliable.
Collaborations
Huang collaborates with talented coworkers such as Hsin Kuan and Chia-Ming Cheng. Their combined expertise contributes to the innovative projects at Xintec Corporation.
Conclusion
Chin-Ching Huang's contributions to chip packaging technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in modern electronics.