Company Filing History:
Years Active: 2001-2002
Title: The Innovations of Chin-Chen Wang
Introduction
Chin-Chen Wang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 3 patents. His work focuses on enhancing the efficiency and reliability of wire bonding processes.
Latest Patents
One of his latest patents is the "Press plate of wire bond checking system." This invention includes a plate with an opening that corresponds to a chip of the substrate and its inner finger. The probe is elastically attached to the edge of the opening for wire bond checking. After the wire bonding process, the wire connecting the chip and the inner finger of the substrate forms a loop with the probe. A current is sent to the substrate from the wire bond checking system to detect any occurrences of wire lift bond or missing wire. Another significant patent is the "Thermal board used for bonding wires in semiconductor manufacturing process." This thermal board provides high temperatures to enhance wire bonding efficiency while preventing the die paddle of a lead frame from oxidizing. It consists of a base board and a platform with a chamber to receive the die paddle, supported by a plurality of posts to ensure it does not directly contact the bottom of the chamber.
Career Highlights
Chin-Chen Wang is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in the semiconductor industry. His work has been instrumental in improving manufacturing processes and ensuring product quality.
Collaborations
Chin-Chen has collaborated with several talented individuals, including Yao-Hsin Feng and Su Tao. Their combined expertise has contributed to the advancement of technology in their field.
Conclusion
Chin-Chen Wang's contributions to semiconductor manufacturing through his innovative patents demonstrate his commitment to enhancing industry standards. His work continues to influence the efficiency and reliability of wire bonding processes in the semiconductor sector.