Suwon-si, South Korea

Chilwoo Kwon

USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2023

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3 patents (USPTO):Explore Patents

Title: Innovations of Chilwoo Kwon

Introduction

Chilwoo Kwon is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work primarily focuses on advancements in package substrates and semiconductor packages.

Latest Patents

Chilwoo Kwon's latest patents include a package substrate and semiconductor package that enhance the efficiency and performance of electronic devices. The package substrate features multiple stacked insulation layers and redistribution layers (RDLs), with impedance patterns strategically arranged on the upper surface of the insulation layers. This innovative design eliminates the need for dummy conductive patterns, allowing for improved insulation lengths that correspond to the thicknesses of the insulation layers. Additionally, he has developed methods for manufacturing connection structures of semiconductor chips, which involve intricate processes to ensure optimal functionality and reliability.

Career Highlights

Chilwoo Kwon is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His role involves research and development in semiconductor packaging, where he applies his expertise to create cutting-edge solutions that meet the demands of modern electronics.

Collaborations

Chilwoo has collaborated with talented coworkers such as Daeyeun Choi and Jaemok Jung. Their combined efforts contribute to the innovative projects at Samsung Electronics, fostering a collaborative environment that drives technological advancements.

Conclusion

Chilwoo Kwon's contributions to semiconductor technology through his patents and work at Samsung Electronics highlight his role as a key innovator in the field. His advancements in package substrates and manufacturing methods continue to influence the development of efficient electronic devices.

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