Hsinchu, Taiwan

Chih-Yuah Cheng

This inventor holds 1 USPTO granted patent. Top assignee: Industrial Technology Research Institute. Active years: 2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Yuah Cheng. Retrieved from https://idiyas.com/inventor/chih-yuah-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2009

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1 patent (USPTO):Explore Patents

Title: Chih-Yuah Cheng: Innovator in Stress Reduction Technologies

Introduction

Chih-Yuah Cheng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of structures that mitigate stress in electronic components. His innovative approach has led to the creation of a patented technology that addresses critical challenges in the industry.

Latest Patents

Cheng holds a patent titled "Structure for reducing stress for vias and fabricating method thereof." This invention provides a unique solution by using a stress block in a lattice structure to isolate wires or vias from insulating materials with a high coefficient of thermal expansion. This design effectively blocks or absorbs shear stress resulting from temperature fluctuations, enhancing the reliability of electronic devices.

Career Highlights

Chih-Yuah Cheng is affiliated with the Industrial Technology Research Institute, where he has been instrumental in advancing research and development in his field. His work has not only contributed to academic knowledge but has also had practical applications in the electronics industry.

Collaborations

Cheng has collaborated with esteemed colleagues such as Yung-Yu Hsu and Rong-Chang Feng. Their combined expertise has fostered a productive research environment, leading to innovative solutions in stress reduction technologies.

Conclusion

Chih-Yuah Cheng's contributions to the field of materials science and his patented innovations demonstrate his commitment to enhancing the performance and reliability of electronic components. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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