Chih-Yi Cheng

Title: Innovator Chih-Yi Cheng: A Pioneer in Damascene Structures

Introduction

Chih-Yi Cheng is a notable inventor based in Chang-Hua, Taiwan. With a keen focus on advancements in semiconductor technology, he has made significant contributions to the field, particularly in the method of forming damascene structures.

Latest Patents

Chih-Yi Cheng holds one patent, titled "Method of forming damascene structures." This innovative method involves providing a substrate that includes a dielectric layer with several via holes. A gap filler is inserted into each via hole, which is followed by the formation of a first and a second anti-reflective coating (ARC) film on the dielectric layer. A photoresist pattern is then created to define a trench pattern, which leads to an etching process that removes parts of the dielectric layer, resulting in multiple trenches.

Career Highlights

Chih-Yi Cheng is affiliated with United Microelectronics Corporation (UMC), a leading global semiconductor foundry. His work at UMC exemplifies his commitment to pushing the boundaries of semiconductor manufacturing through innovative patent developments.

Collaborations

Throughout his career, Chih-Yi has worked alongside skilled professionals such as Chun-Jen Weng and Yu-Shiang Lin. Their collaborative efforts in research and invention have contributed to the advancements seen in the semiconductor industry, ensuring the continued growth and innovation in this vital field.

Conclusion

Chih-Yi Cheng exemplifies the spirit of innovation through his pioneering work in the method of forming damascene structures. His contributions within United Microelectronics Corporation and collaboration with talented colleagues highlight his role as a significant player in the advancement of semiconductor technology. His patent not only underscores his expertise but also plays a crucial part in the evolution of manufacturing processes in the industry.