Company Filing History:
Years Active: 2007-2011
Title: Innovations by Chih Wen Lin
Introduction
Chih Wen Lin is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electrical engineering, particularly in the area of chip stacking technology. With a total of 4 patents to his name, Lin's work has had a considerable impact on the efficiency of electronic components.
Latest Patents
One of Lin's latest patents is titled "Method and apparatus for stacking electrical components using via to provide interconnection." This patent describes an efficient chip stacking structure that includes a leadframe with two surfaces, each capable of attaching stacks of chips. A chip stack can be formed by placing a chip's active surface on the back surface of another chip. Electrical connections between chips and leads on the leadframe are facilitated by bonding pads on chip active surfaces and by vias that extend from the bonding pads through the chips to the back surfaces. Another patent, also focused on chip stacking structure, reiterates the same innovative concepts, emphasizing the efficiency and effectiveness of this technology.
Career Highlights
Chih Wen Lin is currently employed at Macronix International Co., Ltd., where he continues to develop cutting-edge technologies in the semiconductor industry. His work has been instrumental in advancing the capabilities of chip stacking, which is crucial for modern electronic devices.
Collaborations
Lin collaborates with various professionals in his field, including his coworker Chen Jung Tsai. Their combined expertise contributes to the innovative projects at Macronix International Co., Ltd.
Conclusion
Chih Wen Lin's contributions to chip stacking technology exemplify the importance of innovation in the electronics industry. His patents reflect a commitment to enhancing the efficiency of electrical components, making a lasting impact on the field.