Chih-Wei Su

Title: Chih-Wei Su: Innovator in Semiconductor Manufacturing

Chih-Wei Su is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, showcasing his expertise through his innovative patent.

Latest Patents

Chih-Wei Su holds a patent for a manufacturing method of a semiconductor structure. This patent outlines a comprehensive process that includes several key steps. First, a first substrate is provided, followed by the formation of a first dielectric structure on this substrate. At least one first cavity is then created within the first dielectric structure. A first stress adjustment layer is formed in this cavity, covering the dielectric structure. Subsequently, a second substrate is introduced, and a second dielectric structure is formed on it. Similar to the first, at least one second cavity is created in the second dielectric structure, where a second stress adjustment layer is formed. This layer also covers the second dielectric structure. Finally, the first and second stress adjustment layers are bonded together, completing the innovative manufacturing method.

Career Highlights

Chih-Wei Su is currently employed at Powerchip Semiconductor Manufacturing Corporation, a leading company in the semiconductor industry. His work at this organization has allowed him to apply his inventive skills and contribute to advancements in semiconductor technology.

Collaborations

Chih-Wei Su has collaborated with notable colleagues, including Shih-Ping Lee and Shih-Hsorng Shen. These collaborations have likely fostered an environment of innovation and creativity within their projects.

Conclusion

Chih-Wei Su is a distinguished inventor whose work in semiconductor manufacturing has led to valuable advancements in the field. His patent reflects a deep understanding of the complexities involved in semiconductor structures. Through his career at Powerchip Semiconductor Manufacturing Corporation, he continues to influence the industry positively.