This inventor holds 1 USPTO granted patent. Top assignee: Metal Industries Research & Development Centre. Active years: 2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017
Title: Chih-Peng Wang: Heat Dissipation Innovation
Introduction
Chih-Peng Wang is an inventor based in Kaohsiung, Taiwan. His work includes a patented heat-dissipating device designed to address production costs in thermal management.
Latest Patents
Wang’s listed patent, “Heat dissipating device,” describes a device mounted on a heat-generating object. It uses a heat-conductive base with insertion holes and heat-dissipating columns positioned in those holes within the heat-generating region. A heat-conductive silicone layer surrounds each column. The design aims to reduce the high production costs associated with conventional heat-dissipating devices. Wang is credited with 1 patent.
Career Highlights
Wang is associated with the Metal Industries Research & Development Centre. His patented design focuses on combining a conductive base, inserted columns, and silicone layers to dissipate heat.
Collaborations
Chia-Hung Huang and Sung-Mao Chiu are identified as Wang’s coworkers. The available information does not specify their roles in developing the patented device.
Conclusion
Chih-Peng Wang’s patent presents a cost-conscious approach to heat dissipation through a structured base-and-column design, reflecting his work in applied thermal engineering.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile