Taipei, Taiwan

Chih Ming Shen

This inventor holds 2 USPTO granted patents. Top assignee: Industrial Technology Research Institute. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih Ming Shen. Retrieved from https://idiyas.com/inventor/chih-ming-shen-8p9q0qpk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.7

ph-index = 1


Company Filing History:


Years Active: 2022

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2 patents (USPTO):Explore Patents

Title: Chih Ming Shen: Innovator in Human-Machine Interfaces

Introduction

Chih Ming Shen is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of human-machine interfaces and electronic packaging. With a total of 2 patents, Shen's work reflects his commitment to advancing technology and improving user interaction with machines.

Latest Patents

Shen's latest patents include a "Human-machine interface system and communication control device thereof." This innovative system comprises a local operation device, a display device, an HMI display control device, and a communication control device. The local operation device generates a local operation signal, while the display device shows a display image corresponding to a display signal. The HMI display control device generates the display signal based on either the local operation signal or a remote operation signal. The communication control device features a wireless communication connection port for connecting with a remote operation device, allowing for seamless interaction and control.

Another significant patent is the "Lead frame package." This invention includes a first conductive layer, a first electronic component, lead frames, a second conductive layer, and a package body. The first conductive layer contains conductive carriers, and the first electronic component has first pins that are electrically connected to these carriers. The second conductive layer features conductive joints that connect to the lead frames, ensuring efficient electrical connectivity. The package body encapsulates the first conductive layer, the first electronic component, and the lead frames, with the conductive layers positioned on opposite sides of the electronic component.

Career Highlights

Chih Ming Shen is associated with the Industrial Technology Research Institute, where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the functionality and efficiency of electronic devices.

Collaborations

Shen collaborates with talented individuals such as Chih Chung Chiu and Ming Ji Dai, contributing to a dynamic research environment that fosters innovation and creativity.

Conclusion

Chih Ming Shen's contributions to the fields of human-machine interfaces and electronic packaging demonstrate his expertise and dedication to technological advancement. His patents reflect a deep understanding of user interaction and electronic design, making him a significant figure in the innovation landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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