Company Filing History:
Years Active: 2014-2024
Title: The Innovations of Chih-Ming Chao
Introduction
Chih-Ming Chao is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing integrated circuit designs and improving metal patterning methods.
Latest Patents
One of Chih-Ming Chao's latest patents is for an integrated circuit with dummy boundary cells. This innovation involves an integrated circuit that includes multiple macros and a top channel. Each macro is defined by a macro boundary and a main pattern, with the top channel featuring first and second sub-channels. The design incorporates dummy boundary cells to optimize the macro boundaries, enhancing the overall performance of the integrated circuit.
Another notable patent is the track-based fill (TBF) method for metal patterning. This method addresses the challenge of excessive open spaces between conductive elements in semiconductor designs. By analyzing the initial layout and incorporating dummy patterns, Chih-Ming Chao's approach effectively reduces open spaces, leading to improved interconnection layer patterns.
Career Highlights
Chih-Ming Chao is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise in integrated circuits and metal patterning has positioned him as a valuable asset to the company. His innovative approaches have contributed to advancements in semiconductor technology.
Collaborations
Chih-Ming Chao has collaborated with notable colleagues such as Wei-Yi Hu and Chi-Yeh Yu. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas within the semiconductor field.
Conclusion
Chih-Ming Chao's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of advanced integrated circuits and metal patterning methods.