Chih-Jen Hsiao

Title: Innovations by Chih-Jen Hsiao

Introduction

Chih-Jen Hsiao is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of packaging substrates and circuit boards. With a total of two patents to his name, Hsiao's work focuses on enhancing the efficiency and functionality of electronic components.

Latest Patents

Hsiao's latest patents include a packaging substrate and a method for manufacturing the same, as well as a chip packaging body having the same. The packaging substrate consists of a supporting sheet, copper foil, connecting pads, solder balls, a resin layer, a wiring layer, and a solder mask layer. The copper foil is adhered to the supporting sheet using an adhesive sheet, while the connecting pads are formed on the copper foil. The solder balls are positioned on the connecting pads, and the resin layer fills the gaps between them. The wiring layer is constructed on top of the resin layer and solder balls, with terminal portions of the solder balls connected to the wiring layer. The solder mask layer, which is formed on the wiring layer, defines openings that expose portions of the wiring layer, serving as contact pads.

Additionally, Hsiao has developed a circuit board that includes an insulation layer, an electrically conductive layer, and a solder mask layer. The insulation layer features multiple through holes, while the electrically conductive layer covers the insulation layer and the through holes. Portions of the conductive layer are exposed in the through holes, acting as first conductive pads. The solder mask layer covers the conductive layer and defines openings to expose parts of it, which serve as second conductive pads. These second conductive pads are electrically connected to the first conductive pads.

Career Highlights

Chih-Jen Hsiao is currently employed at Zhen Ding Technology Co., Ltd., where he continues to innovate in the field of electronic packaging. His work has contributed to advancements in the manufacturing processes of electronic components, making them more efficient and reliable.

Collaborations

Hsiao has collaborated with notable coworkers, including E-Tung Chou and Chu-Chin Hu, who have also contributed to the field of electronic packaging and circuit design.

Conclusion

Chih-Jen Hsiao's contributions to the field of electronic packaging through his innovative patents demonstrate his commitment to advancing technology. His work at Zhen Ding Technology Co., Ltd. continues