Chih-Hsiung Liao

Title: Chih-Hsiung Liao: Innovator in Metal Substrate Technologies

Introduction

Chih-Hsiung Liao is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of anodized metal substrates, holding a total of 4 patents. His innovative work focuses on enhancing the durability and aesthetic appeal of metal surfaces.

Latest Patents

One of Liao's latest patents is titled "Nickel-free sealing of anodized metal substrates." This invention relates to a method of sealing anodized metal substrates without the use of nickel. The process involves applying a first layer of a nickel-free sealing material over the anodized surface, followed by a second sealing layer to create a robust seal. Another notable patent is "Device housing with metallic luster." This application describes a device housing for electronic devices made from a magnesium-alloy substrate. It includes a treatment layer and a metallic coating that provides a striking metallic luster, enhancing the visual appeal of the device.

Career Highlights

Chih-Hsiung Liao is currently employed at Hewlett-Packard Development Company, L.P. His work at HP has allowed him to explore innovative solutions in electronic device housing and metal substrate treatments. His patents reflect a commitment to advancing technology in these areas.

Collaborations

Liao has collaborated with talented coworkers, including Ya-Ting Yeh and Kuan-Ting Wu. Their combined expertise has contributed to the successful development of innovative technologies in their field.

Conclusion

Chih-Hsiung Liao is a notable inventor whose work in anodized metal substrates and electronic device housings has led to significant advancements in technology. His contributions continue to influence the industry and inspire future innovations.