The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2024
Filed:
Jun. 22, 2018
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 11/24 (2006.01); C09D 5/00 (2006.01); C09D 7/20 (2018.01); C09D 183/04 (2006.01); C25D 11/18 (2006.01); C25D 11/26 (2006.01); C25D 11/30 (2006.01); C25D 11/34 (2006.01); H05K 5/04 (2006.01);
U.S. Cl.
CPC ...
C25D 11/246 (2013.01); C09D 5/002 (2013.01); C09D 7/20 (2018.01); C09D 183/04 (2013.01); C25D 11/18 (2013.01); C25D 11/243 (2013.01); C25D 11/26 (2013.01); C25D 11/30 (2013.01); C25D 11/34 (2013.01); H05K 5/04 (2013.01);
Abstract
The present subject matter relates to Nickel-free (Ni-free) sealing of anodized metal substrates. In an example mentation of the present subject matter, an anodized metal substrate is disposed with a first layer of a Ni-free sealing material over a surface of the anodized metal substrate. Further, a second layer of a second sealing material is disposed atop the first layer to sandwich the first layer of Ni-free sealing material between the surface of the anodized metal substrate and the second layer, to form a sealed metal substrate.