Hsinchu, Taiwan

Chih-Chih Liu

This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2004.


Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal1 out of 834,453 
Other
 patents

Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Innovations by Chih-Chih Liu

Introduction

Chih-Chih Liu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in addressing challenges related to via resistance in organic interlevel dielectrics.

Latest Patents

Chih-Chih Liu holds a patent titled "Method for eliminating via resistance shift in organic ILD." This innovative method involves the application of an adhesion promoter to a cap layer and the oxidation of the adhesion promoter prior to the deposition of an organic interlevel dielectric. This approach effectively reduces via resistance problems during thermal cycles of semiconductor wafers that embody multiple levels of metal and organic interlevel dielectrics. He has 1 patent to his name.

Career Highlights

Throughout his career, Liu has focused on enhancing the reliability and performance of semiconductor devices. His work has been instrumental in improving the manufacturing processes and overall efficiency of semiconductor technologies.

Collaborations

Chih-Chih Liu has collaborated with several professionals in his field, including Darryl D Restaino and Shahab Siddiqui. These collaborations have contributed to the advancement of innovative solutions in semiconductor technology.

Conclusion

Chih-Chih Liu's contributions to the semiconductor industry through his innovative patent demonstrate his commitment to solving complex engineering challenges. His work continues to influence the development of reliable semiconductor technologies.

Profile summary based on public USPTO records.
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