Chih-Cheng Yang

Title: Chih-Cheng Yang: Innovator in Wafer Drying Technology

Introduction

Chih-Cheng Yang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor processing, particularly in the area of wafer drying technology. His innovative approach has the potential to enhance the efficiency of semiconductor manufacturing processes.

Latest Patents

Chih-Cheng Yang holds a patent for a "Method for drying wafer at room temperature." This method involves a multi-step process that includes cleaning, reacting, and pressure releasing steps. The cleaning step requires placing a processing workpiece into a cleaning solvent. The reacting step involves introducing the cleaning solvent into a reaction chamber, where a supercritical fluid is implanted, and the pressure is increased to dissolve the cleaning solvent. Notably, the critical temperature of the supercritical fluid is below room temperature. Finally, the pressure releasing step entails discharging the supercritical fluid along with the cleaning solvent from the reaction chamber after complete dissolution.

Career Highlights

Chih-Cheng Yang is affiliated with National Sun Yat-sen University in Kaohsiung, where he contributes to research and development in semiconductor technologies. His work has garnered attention for its innovative approach to improving wafer processing techniques.

Collaborations

Chih-Cheng Yang collaborates with esteemed colleagues such as Ting-Chang Chang and Wen-Chung Chen. Their combined expertise enhances the research output and innovation potential within their field.

Conclusion

Chih-Cheng Yang's contributions to wafer drying technology exemplify the importance of innovation in semiconductor manufacturing. His patented method showcases a significant advancement that could lead to more efficient production processes in the industry.