Chien-Hsun Lee

Title: Innovations of Chien-Hsun Lee

Introduction

Chien-Hsun Lee is an accomplished inventor based in North Plainfield, NJ, with a notable portfolio of three patents. His work primarily focuses on advanced bonding methods for electronic devices, showcasing his expertise in the field of electronics and materials science.

Latest Patents

One of his latest patents is the "Debondable Metallic Bonding Method." This invention involves a process where metallized chip terminals of an electronic device are temporarily bonded to metallized substrate pads of a wiring substrate. The method allows for electrical testing of the device before it is gently pulled away from the substrate, which can then be reused for testing other devices. Another significant patent is the "Permanent Metallic Bonding Method," which details a procedure for bonding a laser device to a diamond submount using a multi-layer solder approach. This method ensures a permanent joint between the laser device and the submount, enhancing the reliability of electronic components.

Career Highlights

Chien-Hsun Lee has worked at renowned institutions, including AT&T Bell Laboratories, where he contributed to groundbreaking research and development in electronics. His innovative approaches have significantly impacted the field, particularly in the area of device bonding techniques.

Collaborations

Throughout his career, Lee has collaborated with notable professionals, including Avishay Katz and King Lien Tai. These partnerships have fostered a collaborative environment that has led to advancements in technology and innovation.

Conclusion

Chien-Hsun Lee's contributions to the field of electronics through his innovative bonding methods demonstrate his significant impact as an inventor. His patents reflect a deep understanding of materials and their applications in modern technology.