Chien-Feng Li

Title: Chien-Feng Li: Innovator in Electronic Device Packaging

Introduction

Chien-Feng Li is a prominent inventor based in Miao-Li County, Taiwan. He has made significant contributions to the field of electronic device packaging, holding a total of 4 patents. His innovative approaches have enhanced the reliability and electrical properties of electronic devices.

Latest Patents

One of his latest patents is a manufacturing method of a package structure of an electronic device. This method involves providing a carrier plate with a composite structure, which has a first surface and a second surface. An anti-warpage structure is formed on the first surface, while a redistribution structure is created on the second surface. This innovative manufacturing method improves the reliability and electrical properties of the electronic device. Another notable patent involves an electronic device that includes an electronic unit and a redistribution layer. The electronic unit features connection pads, and the redistribution layer is electrically connected to it, enhancing the overall functionality of the device.

Career Highlights

Chien-Feng Li is currently associated with Innolux Corporation, where he continues to develop cutting-edge technologies in electronic device packaging. His work has been instrumental in advancing the capabilities of electronic devices in various applications.

Collaborations

Chien-Feng Li has collaborated with notable colleagues, including Cheng-Chi Wang and Yan-Syun Wang. Their combined expertise has contributed to the successful development of innovative solutions in the field.

Conclusion

Chien-Feng Li's contributions to electronic device packaging demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in enhancing electronic device performance.